Cyclic response of electrodeposited copper films. Experiments and elastic–viscoplastic mean-field modeling

The goal of the present work is to identify and model elastic–viscoplastic behavior electrodeposited copper films under tension–compression loadings. From experimental point view, as proposed in literature, a film on both sides an elastic compliant substrate. overall specimen next subjected tensile loading–unloadings. As substrate remains elastic, elastic–plastic response cyclic loading experimentally determined. A clear kinematic hardening captured. To mechanical response, new self-consistent scheme for polycrystalline materials proposed. core tangent additive interaction law Molinari (2002). single grain rate dependent where accounted at level slip system. parameters are optimized via evolutionary algorithm by comparing predictions response. result, predicted. In addition, heterogeneity plastic strain activity estimated during loading.